An electronic stacking technique could exponentially increase the number of transistors on chips, enabling more efficient AI ...

MIT's innovative method for stacking semiconductors could revolutionize chip design, enabling higher performance and ...

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Laser ablation results in smaller chipping on both the top and bottom sides of the die, as well as a narrower kerf width.

The second phase of Hua Hong Semiconductor's 12-inch wafer fab expansion in Wuxi held a production ceremony on December 10.

Anticipating Trump's return and potential tariffs on Chinese goods, TSMC faces a surge in chip orders, particularly from ...

Lam Research introduced Dextro, the chip industry’s first collaborative robot designed to optimize maintenance in chip ...

Coherent is poised to benefit from the Biden Administration’s CHIPS Act legislation, with initial terms agreed for $33 ...

The CHIPS and Science Act, signed into law by President Joe Biden in August 2022, has been in place for over two years. While ...

Samsung and TSMC are intensifying their rivalry in the race to commercialize 2-nanometer (nm) semiconductor technology.