The company uses direct “gas-to-wafer” epitaxial technology to produce its solar wafers which achieved 24.4% efficiency on ...

Laser ablation results in smaller chipping on both the top and bottom sides of the die, as well as a narrower kerf width.

N2 NanoFlex and GAA nanosheet transistors make TSMC’s 1.15x increase in chip density possible. The gate-all-around tech marks ...

as well as wafer sawing, packaging, and assembly. Our services also extend to equipment and systems testing and certification in fields like small satellites, drones, security, transport, nuclear, etc ...

Bellmann described the discarded sawdust silicon powder as “black gold” and said that around 35% of the silicon in ingot and wafer manufacturing is lost after the sawing process. This powder ...